Jialong Shi1, Leijin Fan2, Xiaofeng Yang3, *, Hu Sun1, *
厦门大学孙虎副教授，工业和信息化部电子第五研究所（中国赛宝实验室）杨晓锋博士
1 School of Aerospace Engineering, Xiamen University, Xiamen 361005, China
2 Department of Materials Science, State Key Laboratory of Molecular Engineering of Polymers, Fudan University, Shanghai 200433, China
3 Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, The fifth Electronics Research Institute of the Ministry of Industry and Information Technology, Guangzhou 511370, China
